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| 樣品真空包埋 |
Sample Bonding |
Sample Lapping |
| 產品規格 |
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| Cutting |
Max. of 12 slides of 28 x 48mm(GTS1), CS30(Economy system) |
| Impregnation |
Max. of 6” x 4”(IU30), Epovac(Economy system) |
| Bonding |
Bonding Jig BJ2, BJ6, BJ12(Up to 28 x 48mm), CB30(Economy system) |
| Lapping |
PM5, LP50, CL40(Economy system) |
| Polishing |
Optional |
| Jig選擇 |
PLJ2, PLJ7(PM5, LP50), CJ30(CL40) |
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| 產品特色 |
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Logitech提供完整Geological Thin Section Sample Preparation樣品製備解決方案，
除了多種主機選擇外，另可根據客戶需求提供客製化的配件，以符合客戶的需求。
購買整套設備，原廠亦提供客戶到英國接受完整的教育訓練，達成技術移轉的服務。
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| Geological Thin Section Sample Preparation Processing Steps： |
| 1. Slabbing and trimming of field specimens
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| 2.Impregnating soft, porous or friable material (optional)
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| 3. First face lapping of cut material |
| 4. Preparation of slides to uniform thickness |
| 5.Bonding specimens to prepared slides |
| 6. Thinning bonded specimens |
| 7. Lapping specimens to chosen thickness
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| 8.Polishing specimens (optional) |
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| 製造商 |
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製造商網址： |
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